A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
METAL-CERAMIC BONDED SUBSTRATE, MANUFACTURING METHOD THEREOF, AND BRAZING MATERIAL
To provide: a metal-ceramic bonded substrate featuring in good heat-cycling characteristics, where the ceramics are resistant to destruction under thermal load as well as good bonding conditions with few bonding voids at the metal-ceramic interface; a method of manufacturing the metal-ceramic bonded substrate; and a metal-ceramic bonding brazing material for use with the metal-ceramic bonded substrate.SOLUTION: Provided is a metal-ceramic bonded substrate in which a metal plate is bonded to a ceramic substrate through a brazing material. The metal plate and the ceramic substrate are bonded through a brazing material comprising: at least one type of element selected from elements for which a value of a Fleischer mismatch parameter is 1.2 or less; at least one type of active metal component; and Cu and Ag. The void fraction at the bonding interface between the metal plate and the ceramic substrate is 1.0 area% or less.SELECTED DRAWING: Figure 1
【課題】熱負荷でセラミックスが破壊し難い良好なヒートサイクル特性を有することと、金属－セラミック界面における接合ボイドが少ない良好な接合状態を有することとの、両方を満たした金属－セラミックス接合基板およびその製造方法、並びに、当該金属－セラミックス接合基板に用いる金属とセラミックスとの接合用のろう材を提供する。【解決手段】ろう材を介して、金属板がセラミックス基板に接合された金属－セラミックス接合基板であって、前記金属板と前記セラミックス基板とが、Ｆｌｅｉｓｃｈｅｒのミスマッチパラメータの値が１．２以下である元素から選択される少なくとも１種類の元素と、少なくとも１種の活性金属成分と、ＣｕおよびＡｇとを含む、ろう材を介して接合され、前記金属板と前記セラミックス基板との接合界面におけるボイド率が１．０面積％以下である金属－セラミックス接合基板を提供する。【選択図】図１
METAL-CERAMIC BONDED SUBSTRATE, MANUFACTURING METHOD THEREOF, AND BRAZING MATERIAL
To provide: a metal-ceramic bonded substrate featuring in good heat-cycling characteristics, where the ceramics are resistant to destruction under thermal load as well as good bonding conditions with few bonding voids at the metal-ceramic interface; a method of manufacturing the metal-ceramic bonded substrate; and a metal-ceramic bonding brazing material for use with the metal-ceramic bonded substrate.SOLUTION: Provided is a metal-ceramic bonded substrate in which a metal plate is bonded to a ceramic substrate through a brazing material. The metal plate and the ceramic substrate are bonded through a brazing material comprising: at least one type of element selected from elements for which a value of a Fleischer mismatch parameter is 1.2 or less; at least one type of active metal component; and Cu and Ag. The void fraction at the bonding interface between the metal plate and the ceramic substrate is 1.0 area% or less.SELECTED DRAWING: Figure 1
【課題】熱負荷でセラミックスが破壊し難い良好なヒートサイクル特性を有することと、金属－セラミック界面における接合ボイドが少ない良好な接合状態を有することとの、両方を満たした金属－セラミックス接合基板およびその製造方法、並びに、当該金属－セラミックス接合基板に用いる金属とセラミックスとの接合用のろう材を提供する。【解決手段】ろう材を介して、金属板がセラミックス基板に接合された金属－セラミックス接合基板であって、前記金属板と前記セラミックス基板とが、Ｆｌｅｉｓｃｈｅｒのミスマッチパラメータの値が１．２以下である元素から選択される少なくとも１種類の元素と、少なくとも１種の活性金属成分と、ＣｕおよびＡｇとを含む、ろう材を介して接合され、前記金属板と前記セラミックス基板との接合界面におけるボイド率が１．０面積％以下である金属－セラミックス接合基板を提供する。【選択図】図１
METAL-CERAMIC BONDED SUBSTRATE, MANUFACTURING METHOD THEREOF, AND BRAZING MATERIAL
金属－セラミックス接合基板およびその製造方法、並びに、ろう材
YUKI MASAYA (author) / TERAMOTO YUKI (author)
2023-01-18
Patent
Electronic Resource
Japanese
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