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METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
To provide a metal-ceramic bonded substrate and a manufacturing method thereof, in which warpage is sufficiently suppressed, there is no need to increase the size of a ceramic substrate in order to secure an insulation distance, and the productivity and manufacturing cost are excellent.SOLUTION: In a metal-ceramic bonded substrate 100 in which a metal circuit board 14 is bonded to one surface of a ceramic substrate 10 and a metal base plate 12 is bonded to the entire other surface of the ceramic substrate 10, the surface of the ceramic substrate 10 is exposed in a region other than a bonding region of the metal circuit board 14 on one surface of the ceramic substrate 10, and when viewed in plan from a direction perpendicular to the one surface of the ceramic substrate 10, the metal base plate 12 is larger than the ceramic substrate 10, and a concave portion 16 is formed in the surface of the metal base plate 12 around the ceramic substrate 10.SELECTED DRAWING: Figure 1A
【課題】反りが十分に抑制され、絶縁距離の確保のためにセラミックス基板を大きくする必要がなく、生産性、製造コストに優れた金属－セラミックス接合基板およびその製造方法を提供することを目的とする。【解決手段】セラミックス基板１０の一方の面に金属回路板１４が接合され、セラミックス基板１０の他方の面の全面に金属ベース板１２が接合された金属－セラミックス接合基板１００であって、セラミックス基板１０の一方の面において金属回路板１２の接合領域を除く領域は、セラミックス基板１０の表面が露出しており、セラミックス基板１０の一方の面に垂直な方向から平面視したときに、金属ベース板１２がセラミックス基板１０よりも大きく、セラミックス基板１０の周囲の金属ベース板１２の表面に凹部１６が形成されていることを特徴とする。【選択図】図１Ａ
METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
To provide a metal-ceramic bonded substrate and a manufacturing method thereof, in which warpage is sufficiently suppressed, there is no need to increase the size of a ceramic substrate in order to secure an insulation distance, and the productivity and manufacturing cost are excellent.SOLUTION: In a metal-ceramic bonded substrate 100 in which a metal circuit board 14 is bonded to one surface of a ceramic substrate 10 and a metal base plate 12 is bonded to the entire other surface of the ceramic substrate 10, the surface of the ceramic substrate 10 is exposed in a region other than a bonding region of the metal circuit board 14 on one surface of the ceramic substrate 10, and when viewed in plan from a direction perpendicular to the one surface of the ceramic substrate 10, the metal base plate 12 is larger than the ceramic substrate 10, and a concave portion 16 is formed in the surface of the metal base plate 12 around the ceramic substrate 10.SELECTED DRAWING: Figure 1A
【課題】反りが十分に抑制され、絶縁距離の確保のためにセラミックス基板を大きくする必要がなく、生産性、製造コストに優れた金属－セラミックス接合基板およびその製造方法を提供することを目的とする。【解決手段】セラミックス基板１０の一方の面に金属回路板１４が接合され、セラミックス基板１０の他方の面の全面に金属ベース板１２が接合された金属－セラミックス接合基板１００であって、セラミックス基板１０の一方の面において金属回路板１２の接合領域を除く領域は、セラミックス基板１０の表面が露出しており、セラミックス基板１０の一方の面に垂直な方向から平面視したときに、金属ベース板１２がセラミックス基板１０よりも大きく、セラミックス基板１０の周囲の金属ベース板１２の表面に凹部１６が形成されていることを特徴とする。【選択図】図１Ａ
METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
金属－セラミックス接合基板およびその製造方法
IDEGUCHI SATORU (author) / MIYAZAKI ATSUSHI (author)
2022-10-14
Patent
Electronic Resource
Japanese
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