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METAL-CERAMIC BONDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF
A metal-ceramic bonded substrate is such that a heat dissipating face is formed in a spherical protruding form, because of which contact pressure with a thermally conductive grease when attaching a heat dissipating fin to the heat dissipating face is high, and high heat dissipation can be secured. Also, by an overflow portion communicating with a metal base portion formation portion being provided farther to an outer side than an external form of the metal-ceramic bonded substrate in an interior of a casting mold, an overflow portion residue is restricted by the casting mold when causing molten metal to solidify and cool, because of which warping deformation occurring because of a difference between linear expansion coefficients of a metal material and a ceramic material can be restricted, and a casting defect such as a running defect in a molten metal flowing process, cold shut, a ripple mark, can be restricted.
METAL-CERAMIC BONDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF
A metal-ceramic bonded substrate is such that a heat dissipating face is formed in a spherical protruding form, because of which contact pressure with a thermally conductive grease when attaching a heat dissipating fin to the heat dissipating face is high, and high heat dissipation can be secured. Also, by an overflow portion communicating with a metal base portion formation portion being provided farther to an outer side than an external form of the metal-ceramic bonded substrate in an interior of a casting mold, an overflow portion residue is restricted by the casting mold when causing molten metal to solidify and cool, because of which warping deformation occurring because of a difference between linear expansion coefficients of a metal material and a ceramic material can be restricted, and a casting defect such as a running defect in a molten metal flowing process, cold shut, a ripple mark, can be restricted.
METAL-CERAMIC BONDED SUBSTRATE, AND MANUFACTURING METHOD THEREOF
WAKABAYASHI YUKI (author) / OYA DAISUKE (author) / TANAKA KEISUKE (author)
2019-11-14
Patent
Electronic Resource
English
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