A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
SINTERED BODY, METHOD FOR MANUFACTURING SINTERED BODY, MEMBER FOR PLASMA DEVICE, METHOD FOR MANUFACTURING MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MANUFACTURING DEVICE
To provide a sintered body having high corrosion resistance, a method for manufacturing a sintered body, a member for a semiconductor manufacturing device, a method for manufacturing a member for a semiconductor manufacturing device, a semiconductor manufacturing device, and a method for manufacturing a semiconductor manufacturing device.SOLUTION: A sintered body according to an embodiment contains 50 [mass %] or more of yttrium oxyfluoride, has a relative density of 97.0 [%] or more, and has a Vickers hardness of 5.0 [GPa] or more. A method for manufacturing a sintered body according to an embodiment includes the steps of molding a molded body containing yttrium oxyfluoride powder having a particle size of 0.3 [μm] or less, and forming a sintered body by normal pressure sintering the molded body at 800°C or less.SELECTED DRAWING: Figure 1
【課題】高い耐食性を有する焼結体、焼結体の製造方法、半導体製造装置用部材、半導体製造装置用部材の製造方法、半導体製造装置、及び半導体製造装置の製造方法の提供。【解決手段】実施形態に係る焼結体は、イットリウムの酸弗化物を５０［質量％］以上含み、相対密度が９７．０［％］以上であり、ビッカース硬度が５．０［ＧＰａ］以上である。実施形態に係る焼結体の製造方法は、粒径が０．３［μｍ］以下のイットリウムの酸弗化物粉を含む成型体を成型するステップと、成型体を８００℃以下で常圧焼結することにより焼結体を形成するステップと、を備える。【選択図】図１
SINTERED BODY, METHOD FOR MANUFACTURING SINTERED BODY, MEMBER FOR PLASMA DEVICE, METHOD FOR MANUFACTURING MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MANUFACTURING DEVICE
To provide a sintered body having high corrosion resistance, a method for manufacturing a sintered body, a member for a semiconductor manufacturing device, a method for manufacturing a member for a semiconductor manufacturing device, a semiconductor manufacturing device, and a method for manufacturing a semiconductor manufacturing device.SOLUTION: A sintered body according to an embodiment contains 50 [mass %] or more of yttrium oxyfluoride, has a relative density of 97.0 [%] or more, and has a Vickers hardness of 5.0 [GPa] or more. A method for manufacturing a sintered body according to an embodiment includes the steps of molding a molded body containing yttrium oxyfluoride powder having a particle size of 0.3 [μm] or less, and forming a sintered body by normal pressure sintering the molded body at 800°C or less.SELECTED DRAWING: Figure 1
【課題】高い耐食性を有する焼結体、焼結体の製造方法、半導体製造装置用部材、半導体製造装置用部材の製造方法、半導体製造装置、及び半導体製造装置の製造方法の提供。【解決手段】実施形態に係る焼結体は、イットリウムの酸弗化物を５０［質量％］以上含み、相対密度が９７．０［％］以上であり、ビッカース硬度が５．０［ＧＰａ］以上である。実施形態に係る焼結体の製造方法は、粒径が０．３［μｍ］以下のイットリウムの酸弗化物粉を含む成型体を成型するステップと、成型体を８００℃以下で常圧焼結することにより焼結体を形成するステップと、を備える。【選択図】図１
SINTERED BODY, METHOD FOR MANUFACTURING SINTERED BODY, MEMBER FOR PLASMA DEVICE, METHOD FOR MANUFACTURING MEMBER FOR SEMICONDUCTOR MANUFACTURING DEVICE, SEMICONDUCTOR MANUFACTURING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MANUFACTURING DEVICE
焼結体、焼結体の製造方法、プラズマ装置用部材、半導体製造装置用部材の製造方法、半導体製造装置、及び半導体製造装置の製造方法
NAGAYAMA KENICHI (author) / NOGUCHI YASUSHI (author) / IIZUKA TOSHIHIRO (author) / KIM CHANG HWAN (author) / WANG YOUNSEON (author)
2023-06-20
Patent
Electronic Resource
Japanese
| European Patent Office | 2019
| European Patent Office | 2022
| European Patent Office | 2022
| European Patent Office | 2019
| European Patent Office | 2023