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COPPER/CERAMIC JOINTED BODY AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic jointed body having excellent cold/heat cycle reliability, capable of suppressing cracking in ceramic members even when subjected to severe cold/heat cycles.SOLUTION: A copper/ceramic jointed body comprises copper members 12, 13 made of copper or a copper alloy and a ceramic member 11, wherein: the copper members 12, 13 and the ceramic member 11 are bonded; at a bonding interface between the ceramic member 11 and the copper members 12, 13, an active metal compound layer 21 made of an active metal compound is formed on the ceramic member 11 side; and microcracks 25 extending from the bonding interface to an interior side of the ceramic member 11 exist in the ceramic member 11, and at least a part of the microcracks 25 is filled with the active metal compound.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅/セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材12,13と、セラミックス部材11とを具備し、銅部材12,13とセラミックス部材11とが接合され、セラミックス部材11と銅部材12,13との接合界面において、セラミックス部材11側には活性金属化合物からなる活性金属化合物層21が形成されており、セラミックス部材11には、接合界面からセラミックス部材11の内部側に進展するマイクロクラック25が存在し、マイクロクラック25の少なくとも一部に活性金属化合物が充填されている。【選択図】図2
COPPER/CERAMIC JOINTED BODY AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic jointed body having excellent cold/heat cycle reliability, capable of suppressing cracking in ceramic members even when subjected to severe cold/heat cycles.SOLUTION: A copper/ceramic jointed body comprises copper members 12, 13 made of copper or a copper alloy and a ceramic member 11, wherein: the copper members 12, 13 and the ceramic member 11 are bonded; at a bonding interface between the ceramic member 11 and the copper members 12, 13, an active metal compound layer 21 made of an active metal compound is formed on the ceramic member 11 side; and microcracks 25 extending from the bonding interface to an interior side of the ceramic member 11 exist in the ceramic member 11, and at least a part of the microcracks 25 is filled with the active metal compound.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅/セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材12,13と、セラミックス部材11とを具備し、銅部材12,13とセラミックス部材11とが接合され、セラミックス部材11と銅部材12,13との接合界面において、セラミックス部材11側には活性金属化合物からなる活性金属化合物層21が形成されており、セラミックス部材11には、接合界面からセラミックス部材11の内部側に進展するマイクロクラック25が存在し、マイクロクラック25の少なくとも一部に活性金属化合物が充填されている。【選択図】図2
COPPER/CERAMIC JOINTED BODY AND INSULATED CIRCUIT BOARD
銅/セラミックス接合体、および、絶縁回路基板
SAKURAI AKIRA (author) / TERASAKI NOBUYUKI (author)
2023-06-22
Patent
Electronic Resource
Japanese
European Patent Office | 2021
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