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COPPER/CERAMIC JOINT BODY AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic joint body that can prevent a ceramic member from cracking even when subjected to a severe thermal cycle, offering superior thermal cycle reliability.SOLUTION: A copper/ceramic joint body 10 is obtained by joining a copper member 12 composed of copper or a copper alloy and a ceramic member 11. At a joint interface between the ceramic member 11 and the copper member 12, a Mg solid-solution layer 31 is formed in which Mg is dissolved in a matrix phase of Cu. In a region E1 from 20 μm to 50 μm from a joint face of the ceramic member 11 to the copper member 12 side, the maximum value of indentation hardness is 90 mgf/μm2 or more and 150 mgf/μm2 or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２との接合界面には、Ｃｕの母相中にＭｇが固溶したＭｇ固溶層３１が形成されており、セラミックス部材１１の接合面から銅部材１２側へ２０μｍから５０μｍまでの領域Ｅ１におけるインデンテーション硬さの最大値が９０ｍｇｆ／μｍ２以上１５０ｍｇｆ／μｍ２以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC JOINT BODY AND INSULATED CIRCUIT BOARD
To provide a copper/ceramic joint body that can prevent a ceramic member from cracking even when subjected to a severe thermal cycle, offering superior thermal cycle reliability.SOLUTION: A copper/ceramic joint body 10 is obtained by joining a copper member 12 composed of copper or a copper alloy and a ceramic member 11. At a joint interface between the ceramic member 11 and the copper member 12, a Mg solid-solution layer 31 is formed in which Mg is dissolved in a matrix phase of Cu. In a region E1 from 20 μm to 50 μm from a joint face of the ceramic member 11 to the copper member 12 side, the maximum value of indentation hardness is 90 mgf/μm2 or more and 150 mgf/μm2 or less.SELECTED DRAWING: Figure 2
【課題】厳しい冷熱サイクルを負荷した場合であっても、セラミックス部材における割れの発生を抑制でき、冷熱サイクル信頼性に優れた銅／セラミックス接合体を提供する。【解決手段】銅又は銅合金からなる銅部材１２と、セラミックス部材１１とが接合されてなる銅／セラミックス接合体１０であって、セラミックス部材１１と銅部材１２との接合界面には、Ｃｕの母相中にＭｇが固溶したＭｇ固溶層３１が形成されており、セラミックス部材１１の接合面から銅部材１２側へ２０μｍから５０μｍまでの領域Ｅ１におけるインデンテーション硬さの最大値が９０ｍｇｆ／μｍ２以上１５０ｍｇｆ／μｍ２以下の範囲内とされている。【選択図】図２
COPPER/CERAMIC JOINT BODY AND INSULATED CIRCUIT BOARD
銅／セラミックス接合体、および、絶縁回路基板
TERASAKI NOBUYUKI (author)
2023-04-03
Patent
Electronic Resource
Japanese
| European Patent Office | 2021
| European Patent Office | 2021
| European Patent Office | 2021