A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COMPOSITE SUBSTRATE MANUFACTURING METHOD AND COMPOSITE SUBSTRATE
To provide a method for manufacturing a composite substrate and a composite substrate capable of manufacturing a composite substrate having a metal circuit without performing etching.SOLUTION: A method for manufacturing a composite substrate 100 includes bonding a metal circuit 8 to the semi-cured resin layer 4 side of a laminate 6 that has the resin filled plate 2 and the semi-cured resin layer 4 provided on at least one main surface of the resin filled plate. The resin filled plate 2 includes a porous sintered nitride plate and a cured resin that fills the pores of the sintered nitride plate.SELECTED DRAWING: Figure 1
【課題】エッチングを行うことなく、金属回路を有する複合基板を製造可能な複合基板の製造方法及び複合基板を提供する。【解決手段】複合基板１００の製造方法であって、樹脂充填板２と樹脂充填板の少なくとも一方の主面上に設けられた半硬化樹脂層４とを有する積層体６の、半硬化樹脂層４側に、金属回路８を接合することを含む。樹脂充填板２は、多孔質の窒化物焼結板と上記窒化物焼結板の気孔に充填された硬化樹脂とを有する。【選択図】図１
COMPOSITE SUBSTRATE MANUFACTURING METHOD AND COMPOSITE SUBSTRATE
To provide a method for manufacturing a composite substrate and a composite substrate capable of manufacturing a composite substrate having a metal circuit without performing etching.SOLUTION: A method for manufacturing a composite substrate 100 includes bonding a metal circuit 8 to the semi-cured resin layer 4 side of a laminate 6 that has the resin filled plate 2 and the semi-cured resin layer 4 provided on at least one main surface of the resin filled plate. The resin filled plate 2 includes a porous sintered nitride plate and a cured resin that fills the pores of the sintered nitride plate.SELECTED DRAWING: Figure 1
【課題】エッチングを行うことなく、金属回路を有する複合基板を製造可能な複合基板の製造方法及び複合基板を提供する。【解決手段】複合基板１００の製造方法であって、樹脂充填板２と樹脂充填板の少なくとも一方の主面上に設けられた半硬化樹脂層４とを有する積層体６の、半硬化樹脂層４側に、金属回路８を接合することを含む。樹脂充填板２は、多孔質の窒化物焼結板と上記窒化物焼結板の気孔に充填された硬化樹脂とを有する。【選択図】図１
COMPOSITE SUBSTRATE MANUFACTURING METHOD AND COMPOSITE SUBSTRATE
複合基板の製造方法、及び、複合基板
MINAKATA YOSHITAKA (author) / IWAKIRI SHOJI (author) / DEKIOKA SEI (author) / YOSHIMATSU RYO (author) / SAKAGUCHI SHINYA (author)
2024-03-13
Patent
Electronic Resource
Japanese
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