A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE HAVING COMPOSITE SUBSTRATE
To provided a composite substrate and a method for manufacturing the same.SOLUTION: A composite substrate 14 is formed from a composite material containing diamond particles 10 and metal, and has a base layer 180 with a first surface 180A and a second surface 180B opposite the first surface, a bottom surface 82B bonded to the first surface of the base layer, a flat layer 82 with a top surface 82A having a surface roughness Ra of 10 nm or less, and an insulating layer 84 bonded directly to the top surface of the flat layer.SELECTED DRAWING: Figure 4A
【課題】複合基板及びその製造方法を提供する。【解決手段】複合基板１４は、ダイヤモンド粒子１０と金属を含む複合材料から形成され、第１表面１８０Ａ及び第１表面の反対側に第２表面１８０Ｂを有する基層１８０と、基層の第１表面に結合される下面８２Ｂと、表面粗さＲａが１０ｎｍ以下である上面８２Ａを有する平坦層８２と、平坦層の上面に直接接合された絶縁層８４と、を備える。【選択図】図４Ａ
COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE HAVING COMPOSITE SUBSTRATE
To provided a composite substrate and a method for manufacturing the same.SOLUTION: A composite substrate 14 is formed from a composite material containing diamond particles 10 and metal, and has a base layer 180 with a first surface 180A and a second surface 180B opposite the first surface, a bottom surface 82B bonded to the first surface of the base layer, a flat layer 82 with a top surface 82A having a surface roughness Ra of 10 nm or less, and an insulating layer 84 bonded directly to the top surface of the flat layer.SELECTED DRAWING: Figure 4A
【課題】複合基板及びその製造方法を提供する。【解決手段】複合基板１４は、ダイヤモンド粒子１０と金属を含む複合材料から形成され、第１表面１８０Ａ及び第１表面の反対側に第２表面１８０Ｂを有する基層１８０と、基層の第１表面に結合される下面８２Ｂと、表面粗さＲａが１０ｎｍ以下である上面８２Ａを有する平坦層８２と、平坦層の上面に直接接合された絶縁層８４と、を備える。【選択図】図４Ａ
COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE HAVING COMPOSITE SUBSTRATE
複合基板およびその製造方法、ならびに当該複合基板を備える半導体装置
ICHIKAWA MASATSUGU (author) / YAMADA SHOICHI (author) / KIHARA TORA (author) / MATSUZAKA YUTAKA (author)
2022-04-11
Patent
Electronic Resource
Japanese
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