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    Method for metalizing vias

    New search for: THIMM ALFRED
    New search for: HERRMANN KLAUS

    A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

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    Method for metalizing vias

    New search for: THIMM ALFRED
    New search for: HERRMANN KLAUS

    A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

    Access

    Download

    Method for metalizing vias

    New search for: THIMM ALFRED
    New search for: HERRMANN KLAUS

    A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

    Access

    Download

    Access

    Download

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Method for metalizing vias

    Contributors:

    THIMM ALFRED (author) / HERRMANN KLAUS (author)

    Publication date:

    2018-12-25

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    English

    Classification:

    IPC:  B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL , Verfahren zum Aufbringen von Flüssigkeiten oder von anderen fließfähigen Stoffen auf Oberflächen allgemein / C04B Kalk , LIME / H01B CABLES , Kabel / H05K PRINTED CIRCUITS , Gedruckte Schaltungen

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