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    Oxide sintered compact and sputtering target formed from said oxide sintered compact

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    An IGZO sintered compact composed of indium (In), gallium (Ga), zinc (Zn), oxygen (O) and unavoidable impurities, wherein the IGZO sintered compact has a flexural strength of 50 MPa or more, and a bulk resistance of 100 mΩcm or less. Provided is a sputtering target capable of suppressing the target cracks and reducing the generation of particles during deposition via DC sputtering, and forming favorable thin films.

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    Oxide sintered compact and sputtering target formed from said oxide sintered compact

    New search for: YAMAGUCHI YOHEI
    New search for: KURIHARA TOSHIYA
    New search for: KAKUTA KOJI

    An IGZO sintered compact composed of indium (In), gallium (Ga), zinc (Zn), oxygen (O) and unavoidable impurities, wherein the IGZO sintered compact has a flexural strength of 50 MPa or more, and a bulk resistance of 100 mΩcm or less. Provided is a sputtering target capable of suppressing the target cracks and reducing the generation of particles during deposition via DC sputtering, and forming favorable thin films.

    Access

    Download

    Oxide sintered compact and sputtering target formed from said oxide sintered compact

    New search for: YAMAGUCHI YOHEI
    New search for: KURIHARA TOSHIYA
    New search for: KAKUTA KOJI

    An IGZO sintered compact composed of indium (In), gallium (Ga), zinc (Zn), oxygen (O) and unavoidable impurities, wherein the IGZO sintered compact has a flexural strength of 50 MPa or more, and a bulk resistance of 100 mΩcm or less. Provided is a sputtering target capable of suppressing the target cracks and reducing the generation of particles during deposition via DC sputtering, and forming favorable thin films.

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    Title:

    Oxide sintered compact and sputtering target formed from said oxide sintered compact

    Contributors:

    YAMAGUCHI YOHEI (author) / KURIHARA TOSHIYA (author) / KAKUTA KOJI (author)

    Publication date:

    2018-12-25

    Type of media:

    Patent

    Type of material:

    Electronic Resource

    Language:

    English

    Classification:

    IPC:  C04B Kalk , LIME / C01G Verbindungen der von den Unterklassen C01D oder C01F nicht umfassten Metalle , COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F / C23C Beschichten metallischer Werkstoffe , COATING METALLIC MATERIAL

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