A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Joined body, holding device, and electrostatic chuck
A joining layer of a joined body includes a joining material which contains, as a main component, a metal having a surface tension of 1000 mN/m or less at its melting point, and a metal layer which has a plurality of pores formed therein and in which at least some of the pores are impregnated with the joining material.
Joined body, holding device, and electrostatic chuck
A joining layer of a joined body includes a joining material which contains, as a main component, a metal having a surface tension of 1000 mN/m or less at its melting point, and a metal layer which has a plurality of pores formed therein and in which at least some of the pores are impregnated with the joining material.
Joined body, holding device, and electrostatic chuck
YOSHIMOTO OSAMU (author) / ARAKAWA RYUICHI (author) / TANAKA TOMOO (author)
2025-03-18
Patent
Electronic Resource
English
IPC:
H01T
SPARK GAPS
,
Funkenstrecken
/
B23K
Löten
,
SOLDERING OR UNSOLDERING
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES