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A platform for research: civil engineering, architecture and urbanism
Composite heat-dissipation substrate and manufacturing method of the same
The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics.
Composite heat-dissipation substrate and manufacturing method of the same
The present disclosure provides a composite heat-dissipation substrate and a method of manufacturing the same. The composite heat-dissipation substrate includes a first ceramic layer having insulating properties, a second porous ceramic layer and a metal layer, wherein the first ceramic layer and the second ceramic layer are continuously connected to each other so as not to form an interface therebetween, and the metal layer is infiltrated into plural pores of the second ceramic layer to be coupled to the ceramic layers, whereby interfacial coupling force between the ceramic layers and the metal layer is very high, thereby providing significantly improved heat dissipation characteristics.
Composite heat-dissipation substrate and manufacturing method of the same
LEE SANG-KWAN (author) / LEE SANG-BOK (author) / YUN JUNG-YEUL (author)
2017-04-04
Patent
Electronic Resource
English
IPC:
C09K
Materialien für Anwendungen, soweit nicht anderweitig vorgesehen
,
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR
/
B22F
Verarbeiten von Metallpulver
,
WORKING METALLIC POWDER
/
B29C
Formen oder Verbinden von Kunststoffen
,
SHAPING OR JOINING OF PLASTICS
/
B32B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
,
Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse
/
C04B
Kalk
,
LIME
/
C22C
Legierungen
,
ALLOYS
/
F21V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF
,
Funktionsmerkmale oder Einzelheiten von Leuchten oder Beleuchtungssystemen
/
F28F
Einzelheiten von Wärmetauschern oder Wärmeübertragungsvorrichtungen für allgemeine Verwendung
,
DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
/
H01L
Halbleiterbauelemente
,
SEMICONDUCTOR DEVICES
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