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HEAT DISSIPATION SUBSTRATE
PROBLEM TO BE SOLVED: To provide a heat dissipation substrate having a high long term reliability, in which thermal stress is suppressed.SOLUTION: In a heat dissipation substrate including a ceramic substrate made of ceramic, and a metallic body bonded to the principal surface of the ceramic substrate via a metal junction containing an active metal, a plurality of ceramic particles composed of ceramic are arranged while being dispersed in the metal junction, and the content of the active metal in the metal junction is larger in the interface region to the ceramic substrate, and the interface region to the ceramic particles, compared with those in other parts than the interface region to the ceramic substrate, and the interface region to the ceramic particles.SELECTED DRAWING: Figure 2
【課題】 熱応力が抑制されており、長期的な信頼性も高い放熱基板を提供する。【解決手段】セラミックスからなるセラミック基板と、活性金属を含有する金属接合部を介して前記セラミック基板の主面と接合した金属体とを備える放熱基板であって、前記セラミックスからなる複数のセラミック粒子が、前記金属接合部の内部に分散配置されており、前記金属接合部における前活性金属の含有割合は、前記セラミック基板との界面領域、および前記セラミック粒子との界面領域の方が、前記セラミック基板との界面領域および前記セラミック粒子との界面領域以外の部分に比べて大きいことを特徴とする放熱基板を提供する。【選択図】図２
HEAT DISSIPATION SUBSTRATE
PROBLEM TO BE SOLVED: To provide a heat dissipation substrate having a high long term reliability, in which thermal stress is suppressed.SOLUTION: In a heat dissipation substrate including a ceramic substrate made of ceramic, and a metallic body bonded to the principal surface of the ceramic substrate via a metal junction containing an active metal, a plurality of ceramic particles composed of ceramic are arranged while being dispersed in the metal junction, and the content of the active metal in the metal junction is larger in the interface region to the ceramic substrate, and the interface region to the ceramic particles, compared with those in other parts than the interface region to the ceramic substrate, and the interface region to the ceramic particles.SELECTED DRAWING: Figure 2
【課題】 熱応力が抑制されており、長期的な信頼性も高い放熱基板を提供する。【解決手段】セラミックスからなるセラミック基板と、活性金属を含有する金属接合部を介して前記セラミック基板の主面と接合した金属体とを備える放熱基板であって、前記セラミックスからなる複数のセラミック粒子が、前記金属接合部の内部に分散配置されており、前記金属接合部における前活性金属の含有割合は、前記セラミック基板との界面領域、および前記セラミック粒子との界面領域の方が、前記セラミック基板との界面領域および前記セラミック粒子との界面領域以外の部分に比べて大きいことを特徴とする放熱基板を提供する。【選択図】図２
HEAT DISSIPATION SUBSTRATE
放熱基板
YUGUCHI AKIO (author) / NAKAMURA KATSUMI (author)
2016-10-20
Patent
Electronic Resource
Japanese
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