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Metal nanodot array fabrication using self-assembled diblock copolymer

Kim, S.J. / Maeng, W.J. / Park, D.H. / Sohn, B.H. / Kim, H.

By combining PS-PMMA self-assembled diblock copolymer (BC) and lift off process, gold nanodot array was fabricated. For surface neutralization, a novel method using conventional self assembled monolayer (SAM), MPTS (3-(p-methoxyphenyl)propyltrichlro-silane) was used. Surface treatment with SAM was analyzed by contact angle measurement and XPS. Upon the fabricated cylindrical nanohole array, gold was evaporated and 10 nm size gold nanoparticle array was fabricated by lift-off process.

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Metal nanodot array fabrication using self-assembled diblock copolymer

Kim, S.J. / Maeng, W.J. / Park, D.H. / Sohn, B.H. / Kim, H.

By combining PS-PMMA self-assembled diblock copolymer (BC) and lift off process, gold nanodot array was fabricated. For surface neutralization, a novel method using conventional self assembled monolayer (SAM), MPTS (3-(p-methoxyphenyl)propyltrichlro-silane) was used. Surface treatment with SAM was analyzed by contact angle measurement and XPS. Upon the fabricated cylindrical nanohole array, gold was evaporated and 10 nm size gold nanoparticle array was fabricated by lift-off process.

Metal nanodot array fabrication using self-assembled diblock copolymer

Kim, S.J. / Maeng, W.J. / Park, D.H. / Sohn, B.H. / Kim, H.

By combining PS-PMMA self-assembled diblock copolymer (BC) and lift off process, gold nanodot array was fabricated. For surface neutralization, a novel method using conventional self assembled monolayer (SAM), MPTS (3-(p-methoxyphenyl)propyltrichlro-silane) was used. Surface treatment with SAM was analyzed by contact angle measurement and XPS. Upon the fabricated cylindrical nanohole array, gold was evaporated and 10 nm size gold nanoparticle array was fabricated by lift-off process.

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Title:

Metal nanodot array fabrication using self-assembled diblock copolymer

Contributors:

Kim, S.J. (author) / Maeng, W.J. (author) / Park, D.H. (author) / Sohn, B.H. (author) / Kim, H. (author)

Published in:

2006 IEEE Nanotechnology Materials and Devices Conference ; 1 ; 488-489

Publication date:

2006-10-01

Size:

600849 byte

ISBN:

978-1-4244-0541-1 , 978-1-4244-0540-4

DOI:

https://doi.org/10.1109/NMDC.2006.4388830

Type of media:

Conference paper

Type of material:

Electronic Resource

Language:

English

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