Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Analysis of failure mechanisms in the interconnect lines of microelectronic circuits
Analysis of failure mechanisms in the interconnect lines of microelectronic circuits
Analysis of failure mechanisms in the interconnect lines of microelectronic circuits
Bower, A. F. (Autor:in) / Craft, D. (Autor:in)
FATIGUE AND FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES ; 21 ; 611-630
01.01.1998
20 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1123
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