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Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection
Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection
Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip-chip interconnection
Yim, M. J. (Autor:in) / Kwon, W. (Autor:in) / Paik, K. W. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 126 ; 59-65
01.01.2006
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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