Rotational grinding of silicon wafers-sub-surface damage inspection

Haapalinna, A. / Nevas, S. / Pahler, D. | British Library Online Contents | 2004

Damage-Free Surface Modification of Hexagonal Silicon Carbide Wafers

Chandler, T. C. / Lari, M. B. / Sudarshan, T. S. | British Library Online Contents | 2000

Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers

Kumar, Arkadeep / Kaminski, Steffi / Melkote, Shreyes N. et al. | British Library Online Contents | 2016

Subsurface crack damage in silicon wafers induced by resin bonded diamond wire sawing

Liu, Tengyun / Ge, Peiqi / Bi, Wenbo et al. | British Library Online Contents | 2017

Surface-Texturing of Single-Crystalline Silicon Wafers

Lin, J.Y. / Chang, P.Y. / Hu, C.K. et al. | British Library Online Contents | 2011