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    The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects

    New search for: Hau-Riege, S. P.
    New search for: Thompson, C. V.

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    The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects

    New search for: Hau-Riege, S. P.
    New search for: Thompson, C. V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects

    New search for: Hau-Riege, S. P.
    New search for: Thompson, C. V.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects

    Contributors:

    Hau-Riege, S. P. (author) / Thompson, C. V. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 15 ; 1797-1802

    Publication date:

    2000-01-01

    Size:

    6 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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