Low-temperature chemical vapor deposition of tantalum nitride from tantalum pentabromide for integrated circuitry copper metallization applications

Chen, X. / Peterson, G. G. / Goldberg, C. et al. | British Library Online Contents | 1999

Chemical Vapor Deposition of Copper for Multilevel Metallization

Kaloyeros, A. E. / Fury, M. A. | British Library Online Contents | 1993

Chemical Vapor Deposition of Cr-Based Thin Films as Diffusion Barriers in Copper Metallization

Maury, F. / Gasqueres, C. / Duminica, F.-D. et al. | British Library Online Contents | 2003

A new metal-organic chemical vapor deposition process for selective copper metallization

Norman, J. A. T. / Muratore, B. A. / Dyer, P. N. et al. | British Library Online Contents | 1993

Chemical Vapor Deposition of Copper for IC Metallization: Precursor Chemistry and Molecular Structure

Doppelt, P. / Baum, T. H. | British Library Online Contents | 1994