Formation and Evolution of Intermetallic Compounds in Solder Joint for Electronic Interconnect

Du, C.H. / Zhao, H.J. / Yin, L.M. et al. | British Library Online Contents | 2011

Grain morphology of intermetallic compounds at solder joints

Choi, W. K. / Jang, S.-Y. / Kim, J. H. et al. | British Library Online Contents | 2002

Electromigration at the high-Pb-eutectic SnPb solder interface

Lai, C. L. / Lin, C. H. / Chen, C. | British Library Online Contents | 2004

Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes

Tian, Y. / Wang, C. / Ge, X. et al. | British Library Online Contents | 2002

Effects of Cu contents in Sn-Cu solder on the composition and morphology of intermetallic compounds at a solder/Ni interface

Yu, D. Q. / Wu, C. M. L. / He, D. P. et al. | British Library Online Contents | 2005