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Experimental Damage Mechanics of Microelectronics Solder Joints under Concurrent Vibration and Thermal Loading
Experimental Damage Mechanics of Microelectronics Solder Joints under Concurrent Vibration and Thermal Loading
Experimental Damage Mechanics of Microelectronics Solder Joints under Concurrent Vibration and Thermal Loading
Basaran, C. (Autor:in) / Cartwright, A. (Autor:in) / Zhao, Y. (Autor:in)
INTERNATIONAL JOURNAL OF DAMAGE MECHANICS ; 10 ; 153-170
01.01.2001
18 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1
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