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Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints
Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints
Influence of Microstructure Coarsening on Thermomechanical Fatigue Behavior of Pb/Sn Eutectic Solder Joints
Tang, H. (Autor:in) / Basaran, C. (Autor:in)
INTERNATIONAL JOURNAL OF DAMAGE MECHANICS ; 10 ; 235-255
01.01.2001
21 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1
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