Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermomechanical fatigue damage evolution in SAC solder joints
Thermomechanical fatigue damage evolution in SAC solder joints
Thermomechanical fatigue damage evolution in SAC solder joints
Matin, M. A. (Autor:in) / Vellinga, W. P. (Autor:in) / Geers, M. G. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 445-446 ; 73-85
01.01.2007
13 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints
British Library Online Contents | 2003
|British Library Online Contents | 2001
|Experimental damage mechanics of microelectronic solder joints under fatigue loading
British Library Online Contents | 2004
|Thermomechanical behavior of micron scale solder joints under dynamic loads
British Library Online Contents | 2000
|Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation
British Library Online Contents | 1999
|