Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint
Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint
Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint
Choi, W. K. (Autor:in) / Kim, J. H. (Autor:in) / Jeong, S. W. (Autor:in) / Lee, H. M. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 43-51
01.01.2002
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
| British Library Online Contents | 2006
Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow
| British Library Online Contents | 2005
Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder
| British Library Online Contents | 2008
Correlation between mechanical tensile properties and microstructure of eutectic Sn-3.5Ag solder
| British Library Online Contents | 2002
Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys
| British Library Online Contents | 2002