Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate: Fid-Bau Portal

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

Yoon, J.-W. / Lee, C.-B. / Jung, S.-B.

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Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

Yoon, J.-W. / Lee, C.-B. / Jung, S.-B.

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

Yoon, J.-W. / Lee, C.-B. / Jung, S.-B.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

Beteiligte:

Yoon, J.-W. (Autor:in) / Lee, C.-B. (Autor:in) / Jung, S.-B. (Autor:in)

Erschienen in:

MATERIALS TRANSACTIONS ; 43 ; 1821-1826

Erscheinungsdatum:

01.01.2002

Format / Umfang:

6 pages

ISSN:

1345-9678

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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