Interfacial reaction and elemental redistribution in Sn3.0Ag0.5Cu-xPd/immersion Au/electroless Ni solder joints after aging

Wang, I. T. / Duh, J. G. / Cheng, C. Y. et al. | British Library Online Contents | 2012

Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

Kumar, A. / Chen, Z. | British Library Online Contents | 2006

(57bi) Bridging the Divide - OHS and Process Safety

Kerin, Trish | British Library Conference Proceedings | 2017

Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate

Yoon, J.-W. / Lee, C.-B. / Jung, S.-B. | British Library Online Contents | 2002

Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion gold-solder interconnection

Sohn, Y.-C. / Yu, J. | British Library Online Contents | 2005