Enhancing Flip Chip Reliability: The Flux Underfill Interface

Boyle, F. / Eichstadt, D. | British Library Online Contents | 2005

Evaluation of epoxy underfill materials for solder flip-chip technology

Park, C. E. / Han, B. J. / Bair, H. E. et al. | British Library Online Contents | 1997

Review of Underfill Encapsulant Development and Performance of Flip Chip Applications

Zoba, D. | British Library Online Contents | 1996

Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements

Lin, C.M. / Chu, C.Y. / Chang, W.L. | British Library Online Contents | 2008

Flow Visualization of Solder Ball Arrangement for Underfill Encapsulation of Flip Chip

Shen, Y. K. / Lin, P. T. / Yeh, S. W. | British Library Online Contents | 2006