Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements
Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements
Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements
Lin, C.M. (Autor:in) / Chu, C.Y. (Autor:in) / Chang, W.L. (Autor:in)
MATERIALS SCIENCE FORUM ; 594 ; 163-168
01.01.2008
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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