Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock

Noh, B. I. / Jung, S. B. | British Library Online Contents | 2006

Flip Chip Underfill A guide for successful processes

Miquel, B. | British Library Online Contents | 2002

Reliability Evaluation of Underfill Encapsulated Pb-Free Flip Chip Package under Thermal Shock Test

Kim, D. G. / Kim, J. W. / Ha, S. S. et al. | British Library Online Contents | 2007

Evaluation of epoxy underfill materials for solder flip-chip technology

Park, C. E. / Han, B. J. / Bair, H. E. et al. | British Library Online Contents | 1997

Review of Underfill Encapsulant Development and Performance of Flip Chip Applications

Zoba, D. | British Library Online Contents | 1996