Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy: Fid-Bau Portal

Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy

Yoon, S. W. / Kim, J. H. / Jeong, S. W. / Lee, H. M.

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Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy

Yoon, S. W. / Kim, J. H. / Jeong, S. W. / Lee, H. M.

Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy

Yoon, S. W. / Kim, J. H. / Jeong, S. W. / Lee, H. M.

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Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

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Titel:

Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy

Beteiligte:

Yoon, S. W. (Autor:in) / Kim, J. H. (Autor:in) / Jeong, S. W. (Autor:in) / Lee, H. M. (Autor:in)

Erschienen in:

MATERIALS TRANSACTIONS ; 44 ; 290-297

Erscheinungsdatum:

01.01.2003

Format / Umfang:

8 pages

ISSN:

1345-9678

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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