TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

Liu, Baolei / Tian, Yanhong / Liu, Wei et al. | British Library Online Contents | 2016

Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder

Chang, C.C. / Yang, S.C. / Chen, Y.J. et al. | British Library Online Contents | 2011

Interfacial Reaction between SnAgCu Solder and Cu Substrate and Reliability Evaluation

Yanghua, X. / Xiaming, X. / Junling, C. | British Library Online Contents | 2005

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Yoon, J. W. / Jung, S. B. | British Library Online Contents | 2006

Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization

Wang, K.-J. / Tsai, Y.-Z. / Duh, J.-G. et al. | British Library Online Contents | 2009