Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy: Fid-Bau Portal

Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy

Yoon, S. W. / Kim, J. H. / Jeong, S. W. / Lee, H. M.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy

Yoon, S. W. / Kim, J. H. / Jeong, S. W. / Lee, H. M.

Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy

Yoon, S. W. / Kim, J. H. / Jeong, S. W. / Lee, H. M.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Effect of Under Bump Metallurgy and Reflows on Shear Strength and Microstructure of Joint between Cu Substrate and Sn-36Pb-2Ag Solder Alloy

Contributors:

Yoon, S. W. (author) / Kim, J. H. (author) / Jeong, S. W. (author) / Lee, H. M. (author)

Published in:

MATERIALS TRANSACTIONS ; 44 ; 290-297

Publication date:

2003-01-01

Size:

8 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Choi, J. H. / Jung, B. Y. / Jun, S. W. et al. | British Library Online Contents | 2004

TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

Liu, Baolei / Tian, Yanhong / Liu, Wei et al. | British Library Online Contents | 2016

TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

Liu, Baolei / Tian, Yanhong / Liu, Wei et al. | British Library Online Contents | 2016

Aging Treatment Characteristics of Shear Strength in Micro Solder Bump

Yu, C.-H. / Kim, K.-S. / Sun, Y.-B. et al. | British Library Online Contents | 2002

Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages

Yu, C.-H. / Kim, K.-S. / Yang, J.-M. | British Library Online Contents | 2003