New challenges for 300mm Si technology: 3D interconnects at wafer scale by aligned wafer bonding

Dragoi, V. / Lindner, P. / Tischler, M. et al. | British Library Online Contents | 2002

Design and Construction Issues for 300mm Semiconductor Manufacturing Facilities

Merchant, S. / Chasey, A. / American Society of Civil Engineers | British Library Conference Proceedings | 2000

Spheron™ WLCSP Technology Qualification and Scale Up to 300mm

Cardoso, A. / Curtis, A. | British Library Online Contents | 2014

Defect requirements for advanced 300mm DRAM substrates

Kupfer, C. / Roth, H. / Dietrich, H. | British Library Online Contents | 2002

E-MRS Spring Meeting 2002. The 300mm Silicon Era: Material, Equipment, Technology

Richter, H. / Umeno, M. / Wagner, P. | British Library Online Contents | 2002