Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages

Zhang, F. / Li, M. / Chum, C. C. et al. | British Library Online Contents | 2002

Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

Chen, S.-w. / Lin, S.-k. / Jao, J.-m. | British Library Online Contents | 2004

Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

Kim, D. G. / Jang, H. S. / Kim, Y. J. et al. | British Library Online Contents | 2005

Optimizing maximum equivalent strain on solder balls in flip-chip packages

Wu, G. H. / Ju, S. H. / Hsu, T. C. et al. | British Library Online Contents | 2008

Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps

Huang, C.-S. / Duh, J.-G. | British Library Online Contents | 2003