Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Characterizing the formation and growth of intermetallic compound in the solder joint
Characterizing the formation and growth of intermetallic compound in the solder joint
Characterizing the formation and growth of intermetallic compound in the solder joint
Lee, Y. G. (Autor:in) / Duh, J. G. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 33 ; 5569-5572
01.01.1998
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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