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Elasticity and resistivity study on the electromigration effects observed in aluminum-silicon-copper alloy thin films
Elasticity and resistivity study on the electromigration effects observed in aluminum-silicon-copper alloy thin films
Elasticity and resistivity study on the electromigration effects observed in aluminum-silicon-copper alloy thin films
Mizubayashi, H. (Autor:in) / Kashimura, D. (Autor:in) / Yokota, K. (Autor:in) / Tanimoto, H. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 370 ; 168-171
01.01.2004
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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