Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections
Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections
Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections
Mattila, T. T. (Autor:in) / Vuorinen, V. (Autor:in) / Kivilahti, J. K. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 3214-3223
01.01.2004
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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