A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections
Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections
Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections
Mattila, T. T. (author) / Vuorinen, V. (author) / Kivilahti, J. K. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 19 ; 3214-3223
2004-01-01
10 pages
Article (Journal)
English
DDC:
620.11
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