Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Characteristics of Sn-2.5 Ag flip chip solder jointsunder thermal shock test conditions
Characteristics of Sn-2.5 Ag flip chip solder jointsunder thermal shock test conditions
Characteristics of Sn-2.5 Ag flip chip solder jointsunder thermal shock test conditions
Yang, K.C. (Autor:in) / Lee, S.H. (Autor:in) / Kim, J.-M. (Autor:in) / Choi, Y.K. (Autor:in) / Farson, D.F. (Autor:in) / Shin, Y.E. (Autor:in)
JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY ; 23 ; 435-441
01.01.2009
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621
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