Variable Flip Chip Assembly for High-volume Production Solder Bump and Adhesive Flip Chip Advantages

Pajonk, J. / Halk, D. R. | British Library Online Contents | 2004

Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating

Yoon, J.-W. / Chun, H.-S. / Jung, S.-B. | British Library Online Contents | 2007

Fluxless Sn-3.5 mass%Ag Solder Bump Flip Chip Bonding by Ultrasonic Wave

Hong, S.-M. / Kang, C.-S. / Jung, J.-P. | British Library Online Contents | 2002

Flip Chip Bump Formation of Sn-1.8Bi-0.8Cu-0.6In Solder by Stencil Printing

Lee, J. / Jung, J.-P. / Cheon, C.-S. et al. | British Library Online Contents | 2005

Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

Koo, J. M. / Kim, Y. N. / Yoon, J. W. et al. | British Library Online Contents | 2008