Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It's Effects on the Shear Force of the Solder Bumps: Fid-Bau Portal

Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It's Effects on the Shear Force of the Solder Bumps

Park, S. H. / Kim, Y. H.

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Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It's Effects on the Shear Force of the Solder Bumps

Park, S. H. / Kim, Y. H.

Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It's Effects on the Shear Force of the Solder Bumps

Park, S. H. / Kim, Y. H.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

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Dokumentinformationen

Titel:

Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It's Effects on the Shear Force of the Solder Bumps

Beteiligte:

Park, S. H. (Autor:in) / Kim, Y. H. (Autor:in)

Erschienen in:

MATERIALS SCIENCE FORUM ; 475/479 ; 1881-1884

Erscheinungsdatum:

01.01.2005

Format / Umfang:

4 pages

ISSN:

0255-5476

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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