Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING
SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING
SiC-NANOPARTICLE DISPERSED COMPOSITE SOLDER BUMPS FABRICATED BY ELECTROPLATING
Shin, Y.-S. (Autor:in) / Ko, Y.-K. (Autor:in) / Kim, J.-K. (Autor:in) / Yoo, S. (Autor:in) / Lee, C.-W. (Autor:in)
SURFACE REVIEW AND LETTERS ; 17 ; 201-205
01.01.2010
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
530.417
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Process integration of electroplated solder bumps for WLP
| British Library Online Contents | 2001
Formation of Ag3Sn plates in SnAgCu solder bumps
| British Library Online Contents | 2010
Nanoparticle-Dispersed Liquid Crystals Fabricated by Sputter Doping
| British Library Online Contents | 2010
Microstructural evolution during electromigration in eutectic SnAg solder bumps
| British Library Online Contents | 2005
Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating
| British Library Online Contents | 2007