Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It's Effects on the Shear Force of the Solder Bumps: Fid-Bau Portal

Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It's Effects on the Shear Force of the Solder Bumps

Park, S. H. / Kim, Y. H.

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Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It's Effects on the Shear Force of the Solder Bumps

Park, S. H. / Kim, Y. H.

Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It's Effects on the Shear Force of the Solder Bumps

Park, S. H. / Kim, Y. H.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It's Effects on the Shear Force of the Solder Bumps

Contributors:

Park, S. H. (author) / Kim, Y. H. (author)

Published in:

MATERIALS SCIENCE FORUM ; 475/479 ; 1881-1884

Publication date:

2005-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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