Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

Kim, D. G. / Jang, H. S. / Kim, Y. J. et al. | British Library Online Contents | 2005

Influence of interfacial intermetallic compound on fracture behavior of solder joints

Lee, H. T. / Chen, M. H. / Jao, H. M. et al. | British Library Online Contents | 2003

Interfacial reactions between eutectic Sn–Pb solder and Co substrate

Wang, C. h. / Kuo, C. y. | British Library Online Contents | 2011

Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

Yoon, J. W. / Jung, S. B. | British Library Online Contents | 2004

Activation energies of intermetallic compound growth at interface between Sn-5Bi-3·5Ag solder and Cu substrate

Yoon, J.-W. / Lee, C.-B. / Jung, S.-B. | British Library Online Contents | 2003