Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate

Yoon, J. W. / Jung, S. B. | British Library Online Contents | 2004

Evolution of Intermetallic Compound at the Interface between AuSn Solder and Metallization Layer

Wei, Z. / Chunqing, W. / Bohan, Y. | British Library Online Contents | 2006

Kinetics of intermetallic compound layer growth and interfacial reactions between Sn-8Zn-5In solder and bare copper substrate

Kim, D.-G. / Jang, H.-S. / Jung, S.-B. | British Library Online Contents | 2005

Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface

Ma, X. / Wang, F. / Qian, Y. et al. | British Library Online Contents | 2003

Characterizing the formation and growth of intermetallic compound in the solder joint

Lee, Y. G. / Duh, J. G. | British Library Online Contents | 1998