TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate: Fid-Bau Portal

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Yoon, J. W. / Jung, S. B.

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TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Yoon, J. W. / Jung, S. B.

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Yoon, J. W. / Jung, S. B.

Zugriff

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Titel:

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate

Beteiligte:

Yoon, J. W. (Autor:in) / Jung, S. B. (Autor:in) / Kim, H. S. / Li, Y. B. / Lee, S. W.

Erschienen in:

Eco-Materials Processing & Design VII: Proceedings of the Conference of the 7^t^h International Symposium on Eco-Materials Processing & Design January 8-11, 2006, Chengdu, China ; 554-557

MATERIALS SCIENCE FORUM ; 510/511

Erscheinungsdatum:

01.01.2006

Format / Umfang:

4 pages

ISSN:

0255-5476

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

Kang, H.-B. / Lee, J.-W. / Bae, J.-H. et al. | British Library Online Contents | 2008

Correlation between interfacial reactions and shear strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu solder joints

Yoon, J. W. / Chun, H. S. / Jung, S. B. | British Library Online Contents | 2008

Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder

Zhao, J. / Miyashita, Y. / Mutoh, Y. | British Library Online Contents | 2001

Interfacial Reaction of Electroless Ni-P Plating with Sn-3.5Ag (-Co) Solder

Nishikawa, H. / Komatsu, A. / Takemoto, T. | British Library Online Contents | 2008

Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow

Yoon, J. W. / Kim, S. W. / Jung, S. B. | British Library Online Contents | 2005

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