Formation of bulk Cu6Sn5 intermetallic compounds in Sn–Cu lead-free solders during solidification

Shen, J. / Liu, Y. C. / Gao, H. X. | British Library Online Contents | 2007

Investigation of Intermetallic Phases Formed in Lead-Free Solders

Nagy, E. / Gyenes, A. / Molnar, A. et al. | British Library Online Contents | 2015

Solderability and intermetallic compounds formation of Sn-9Zn-xAg lead-free solders wetted on Cu substrate

Chen, W. / Xue, S. / Wang, H. et al. | British Library Online Contents | 2009

Intermetallic compound formation between lead-free solders (Sn) and Cu or Ni electrodes

Sasaki, T. / Tanaka, M. / Ohno, Y. | British Library Online Contents | 2007

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Sohn, Y. C. / Yu, J. / Kang, S. K. et al. | British Library Online Contents | 2004