Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Residual Stress Evaluation of Thin Film Using Strip Bending Test
Residual Stress Evaluation of Thin Film Using Strip Bending Test
Residual Stress Evaluation of Thin Film Using Strip Bending Test
Kim, J. H. (Autor:in) / Lee, H. J. (Autor:in) / Han, S. W. (Autor:in) / Kim, J. M. (Autor:in) / Baek, C. W. (Autor:in) / Lee, S.-S. / Lee, J. H. / Park, I. K. / Song, S.-J. / Choi, M. Y.
01.01.2006
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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