Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad: Fid-Bau Portal

Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad

Sharif, A. / Chan, Y. C. / Zhong, H. W.

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Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad

Sharif, A. / Chan, Y. C. / Zhong, H. W.

Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad

Sharif, A. / Chan, Y. C. / Zhong, H. W.

Zugriff

Zugriff über TIB

Verfügbarkeit in meiner Bibliothek prüfen

Bestellung bei Subito €

Seitennavigation

Dokumentinformationen

Ähnliche Titel

Exportieren, teilen und zitieren

Dokumentinformationen

Titel:

Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad

Beteiligte:

Sharif, A. (Autor:in) / Chan, Y. C. (Autor:in) / Zhong, H. W. (Autor:in)

Erschienen in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 40-45

Erscheinungsdatum:

01.01.2007

Format / Umfang:

6 pages

ISSN:

0884-2914

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.11

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