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    Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad

    New search for: Sharif, A.
    New search for: Chan, Y. C.
    New search for: Zhong, H. W.

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    Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad

    New search for: Sharif, A.
    New search for: Chan, Y. C.
    New search for: Zhong, H. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad

    New search for: Sharif, A.
    New search for: Chan, Y. C.
    New search for: Zhong, H. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Effect of multiple reflows on mechanical strength of the interface formed between Sn-Zn-Bi solder and Au/Ni/Cu bond pad

    Contributors:

    Sharif, A. (author) / Chan, Y. C. (author) / Zhong, H. W. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 22 ; 40-45

    Publication date:

    2007-01-01

    Size:

    6 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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